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CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
A
C
PIN A1
REFERENCE
2X 0.10 C
2X 0.10 C
DETAIL A
0.10 C
0.05 C
NOTE 4
E
TOP VIEW
A1
A B
D
A2
* Die Coat
(Optional)
DETAIL A
SEATING
PLANE
A3*
A2
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A 0.28 0.38
A1 0.08 0.12
A2 0.23 REF
A3* 0.025 REF
b 0.16 0.20
D 0.84 BSC
E 0.86 BSC
e 0.40 BSC
* Die Coat (Optional)
SIDE VIEW
NOTE 3
NOTE 5
0.10
M
4X b
C A B
B
e
e
RECOMMENDED
SOLDERING FOOTPRINT*
A1 PACKAGE
OUTLINE
A
1 2
BOTTOM VIEW
0.40
PITCH
4X
0.40
PITCH
0.18
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
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